Our this modified sub-micron spherical silica features high purity (>99.9%), excellent sphericity (>95%), uniform particle size, and good dispersion, widely used in electronics, coatings, and cosmetics.
Cas-Nr. :
7631-86-9Molekularformel :
SiO₂Dichte :
>2.2 g/cm³Schmelzpunkt :
~1713℃Verpackung :
25kg/drumAussehen :
WhiteReinheit :
99.9%minBasic information
This sub-micron spherical silica powder (SiO₂, >99.9%) features a melting point of ~1713℃, density >2.2 g/cm³, and hydrophobic surface modification. With >95% sphericity, it offers excellent flowability for electronics and coatings.
Specification

1: Improves thermal conductivity and moisture resistance in EMC/CCL with its spherical, hydrophobic structure.
2: Enhances rheology, dispersion, and mechanical strength in electronic glues and sealants.
3: Boosts scratch resistance and dimensional stability in plastics and thin films without sacrificing clarity.
4: Delivers smooth texture, oil control, and soft-focus effects in foundations and powders.
Factor
y
FAQ
Q: Are you trading company or manufacturer?
A: We are factory.
Q: How long is your delivery time?
A: Generally it is 5-10 days if the goods are in stock. Or it is 15-20 days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra ?
A: Yes, we could offer the sample for free charge but do not pay the cost of freight.
Q: What is your terms of payment ?
A: Payment<=1000USD, 100% in advance. Payment>=1000USD, 30% T/T in advance ,balance before shippment.
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