Name: Aluminium Nitride Aln Powder 24304-00-5
Availability: InStock

Aluminium Nitride Aln Powder 24304-00-5

Aluminum nitride is a high-performance advanced ceramic material. It has high thermal conductivity and excellent insulation properties, meeting the heat dissipation requirements of electronic devices; it has outstanding chemical stability and is resistant to acid and alkali corrosion; it also possesses excellent mechanical properties and a low expansion coefficient, with excellent impact resistance and low deformation.

Cas No. :
24304-00-5
Molecular Formula :
AlN
Melting point :
2200℃
Place of Origin :
China
Apperance :
white gray
Purity :
99.5%min

Product Details

Basic information

High-purity micron-sized aluminum nitride (with a purity of ≥ 99.5%, particle size ranging from 1 to 10 μm, thermal conductivity of 150 - 200 W/(m・K)) is suitable for high thermal conductivity insulation scenarios; filler aluminum nitride (with a purity of 95% - 99% and a particle size of 5 - 50 μm, with a filling rate of 60% - 70%) enhances the thermal conductivity of the composite material; granulated material (particle size ranging from 50 to 200 μm, sintering shrinkage rate of 12% - 15%) is convenient for ceramic molding; ceramics (density of ≥ 3.2 g/cm³, thermal conductivity of 180 - 220 W/(m・K), with a resistance of 1800°C) have excellent insulation properties; structural components (dimensional accuracy of ± 0.02 mm, Ra ≤ 0.8 μm) are suitable for electronic packaging and heat dissipation substrates.

Specification

Item	M-G	F-01	F-10	F-30	F-50
Mean particle size (μm)	1.2~1.5	1.0~1.2	5~10	20~40	40~60
Specific surface area (m2/g)	2.3~2.9	-	-	-	-
Impurity	O (wt.%) <0.9 C (ppm) <600 Ca (ppm) <500 Si (ppm) <100 Fe (ppm) <30	-	-	-	-
Particle shape	-	subsphaeroidal	subsphaeroidal	sphere	sphere
Real density (g/cm3)	-	3.26	3.26	>3.30	>3.30
Thermal conductivity (W/m・K)	-	>170	>170	>170	>170
Bulk density (g/cm3)	-	0.3~0.5	1.3~1.5	1.4~1.6	1.6~1.8
Tap density (g/cm3)	-	0.7~0.9	1.6~1.8	1.8~2.0	1.8~2.0

Application

1:As a high thermal conductivity insulating filler, it is combined with epoxy resin and other materials to form a substrate, which is suitable for CPU and power module packaging. Its thermal conductivity of 150-200W/(m・K) can quickly disperse heat and ensure the stable operation of electronic components.
2: Used for LED heat dissipation glue and new energy vehicle battery pack potting material. When the filling rate reaches 60%-70%, it can significantly enhance the thermal conductivity of the material while maintaining good insulation and processing properties.
3: After granulation treatment, a nitrogenized aluminum oxide ceramic green body is formed. The particles have good fluidity and low sintering shrinkage rate, providing a high-quality raw material basis for subsequent sintering into high-density ceramics (such as heat sinks, insulating parts).

4: It is made into heat-conducting gaskets or heat-removing pastes, which are applied to semiconductor lasers and radio frequency devices. With excellent heat conduction and electrical insulation properties, it effectively solves the problem of local high temperature in the devices, and prolongs their service life.